Conduction Heat Transfer Expertise from k Technology
Advanced solid conduction concepts from k Technology are used in thermal applications all over the world.
Among its primary thermal solutions, k Technology developed the patented k-Core heat transfer system, which uses encapsulated graphite to help alleviate heat in high-power electronics for applications in aerospace, military and commercial applications. The k-Core material uses APG as an insert within an encapsulating structure. k-Core can be fabricated by employing most conventional thermal management materials as the encapsulant (e.g., aluminium and copper alloys, ceramics, and composites), as dictated by user need and application. Light in weight, the passive k-Core system is highly conductive thermally and offers designers the ability to tailor coefficients of thermal expansion (CTE) if needed. The k-Core heat transfer system is typically designed for a specific application by our experienced engineering team.
Because k-Core can be encapsulated in a wide range of conventional thermal management metals and materials, k-Core heat transfer products provide “drop-in” replacements for the solid metal conductors. As a result, thermal designers can significantly reduce their electronic component temperatures, thereby improving performance, reliability and greatly prolonging the life of your most valued electronics systems.
k Technology’s products are used in aerospace satellites, avionics and military aircraft such as the F-35, F-22 and F-16 fighter planes. k Technology thermal management products also cool high power density electronic packaging, power electronics and other applications requiring high-performance heat transfer.
The k-Core Product Line
- Patented encapsulated APG material system has three times the conductivity (k) of copper with the mass of aluminium
- APG graphite provides a high k path
- Encapsulant sets the CTE and structural properties
- Encapsulant material is selected to satisfy requirements
- Drop-in replacement for conventional conduction solutions
Table 1 k-Core Material Properties with Various Encapsulant Materials
Material |
Thermal Conductivity (W/mK) |
Density (g/cm3) |
Coefficient of Thermal Expansion (CTE) (ppm/K) | Specific Conductivity (conductivity/ density) (W/m·K/g/cm3) |
|||
w/o APG insert |
with k-Core |
w/o APG insert |
with k-Core |
w/o APG insert |
with k-Core |
||
Copper (OFHC) |
390.0 |
1176.0 |
8.90 |
4.92 |
16.9 |
43.8 |
239.2 |
Beryllium |
220.0 |
1108.0 |
1.80 |
2.08 |
13.5 |
122.2 |
533.7 |
Aluminium Beryllium (62% Be) |
210.0 |
1104.0 |
2.10 |
2.20 |
13.9 |
100.0 |
502.7 |
Aluminium (6061) |
180.0 |
1092.0 |
2.80 |
2.48 |
23.6 |
64.3` |
441.0 |
AlSi (40% Si) |
126.0 |
1070.4 |
2.53 |
2.37 |
15.0 |
49.8 |
452.0 |
Magnesium (AZM) |
79.0 |
1051.6 |
1.80 |
2.08 |
27.3 |
43.9 |
506.6 |
Kovar |
14.0 |
1025.6 |
8.40 |
4.72 |
5.9 |
1.7 |
217.5 |
Custom thermal management solutions tailored to specific user needs. From one-of-a-kind spacecraft components that satisfy specific and demanding requirements to the production of thousands of thermal cores and heat spreaders to a given specification, k Technology has the expertise and experience to solve your thermal management challenges.
Thermal management challenge? Take the first step towards the solution for you.
1 Octobre 2018 : Devis prix présentation techniques : contactez votre représentant en France – Suisse – Belgique ou directement à l’usine Anglaise :Adresse usine : Unit 12/Wansbeck Business Park/Rotary Parkway, Ashington NE63 8QW, Royaume-Uni / +44 1670 859500
Email France Belgique Suisse : Contact af-ingenierie.fr (formulaire antispam ci dessous)
http://management-thermique.fr/contactez-nous
http://management-thermique.fr/ Devis Contact Thermacore Europe