Conduction Heat Transfer Expertise K-Core

Conduction Heat Transfer Expertise from k Technology

Advanced solid conduction concepts from k Technology are used in thermal applications all over the world.

Thermal SpreadersAmong its primary thermal solutions, k Technology developed the patented k-Core heat transfer system, which uses encapsulated graphite to help alleviate heat in high-power electronics for applications in aerospace, military and commercial applications. The k-Core material uses APG as an insert within an encapsulating structure. k-Core can be fabricated by employing most conventional thermal management materials as the encapsulant (e.g., aluminium and copper alloys, ceramics, and composites), as dictated by user need and application. Light in weight, the passive k-Core system is highly conductive thermally and offers designers the ability to tailor coefficients of thermal expansion (CTE) if needed. The k-Core heat transfer system is typically designed for a specific application by our experienced engineering team.

Because k-Core can be encapsulated in a wide range of conventional thermal management metals and materials, k-Core heat transfer products provide “drop-in” replacements for the solid metal conductors. As a result, thermal designers can significantly reduce their electronic component temperatures, thereby improving performance, reliability and greatly prolonging the life of your most valued electronics systems.

k Technology’s products are used in aerospace satellites, avionics and military aircraft such as the F-35, F-22 and F-16 fighter planes. k Technology thermal management products also cool high power density electronic packaging, power electronics and other applications requiring high-performance heat transfer.

The k-Core Product Line

  • Patented encapsulated APG material system has three times the conductivity (k) of copper with the mass of aluminium
  • APG graphite provides a high k path
  • Encapsulant sets the CTE and structural properties
  • Encapsulant material is selected to satisfy requirements
  • Drop-in replacement for conventional conduction solutions

Table 1 k-Core Material Properties with Various Encapsulant Materials

Material

Thermal Conductivity (W/mK)

Density (g/cm3)

Coefficient of Thermal Expansion (CTE)  (ppm/K) Specific Conductivity  (conductivity/ density)
(W/m·K/g/cm3)

w/o APG insert

with k-Core

w/o APG insert

with k-Core

w/o APG insert

with

k-Core

Copper (OFHC)

390.0

1176.0

8.90

4.92

16.9

43.8

239.2

Beryllium

220.0

1108.0

1.80

2.08

13.5

122.2

533.7

Aluminium Beryllium (62% Be)

210.0

1104.0

2.10

2.20

13.9

100.0

502.7

Aluminium (6061)

180.0

1092.0

2.80

2.48

23.6

64.3`

441.0

AlSi (40% Si)

126.0

1070.4

2.53

2.37

15.0

49.8

452.0

Magnesium (AZM)

79.0

1051.6

1.80

2.08

27.3

43.9

506.6

Kovar

14.0

1025.6

8.40

4.72

5.9

1.7

217.5

Custom thermal management solutions tailored to specific user needs. From one-of-a-kind spacecraft components that satisfy specific and demanding requirements to the production of thousands of thermal cores and heat spreaders to a given specification, k Technology has the expertise and experience to solve your thermal management challenges.

Thermal management challenge? Take the first step towards the solution for you.

1 Octobre 2018 : Devis prix présentation techniques : contactez votre représentant en France – Suisse – Belgique ou directement à l’usine Anglaise :Adresse usine : Unit 12/Wansbeck Business Park/Rotary Parkway, Ashington NE63 8QW, Royaume-Uni / +44 1670 859500

Email France Belgique Suisse : Contact af-ingenierie.fr (formulaire antispam ci dessous)

http://management-thermique.fr/contactez-nous

http://management-thermique.fr/ Devis Contact Thermacore Europe

Read the latest news from Aavid Thermacore Actualité

Read the latest news from Aavid Thermacore.

October 1, 2018

Thermacore k-Core Technology Cools Europe Space products (UK is ITAR free)

September 11, 2018
Thermacore Europe Attended toIndustry Space Days (ISD) wich are organised by ESA to bring together the main European players in the space sector. Their main purpose is to increase the involvement of SMEs in space activities and to foster cross-fertilisation between the different actors in the entire space sector.
KCore cooling and copper water heatpipe samples where shown to various customer and end-user.
May 18, 2017
October 12, 2016
June 24, 2016
April 27, 2016
January 19, 2016
August 11, 2015
July 28, 2015
July 14, 2015
June 30, 2015
May 08, 2015
March 03, 2015
February 27, 2015
December 16, 2014
September 09, 2014
April 29, 2014
December 03, 2013
August 29, 2013
April 16, 2013
March 19, 2013
December 04, 2012
March 13, 2012
February 28, 2012
January 31, 2012
June 14, 2011
March 15, 2011
January 25, 2011
June 23, 2010
May 18, 2010
April 20, 2010
March 10, 2010
February 02, 2010
October 19, 2009
August 11, 2009
June 23, 2009
April 07, 2009
January 06, 2009
October 07, 2008
September 08, 2008
May 07, 2008

Gestion thermique et refroidissement de l’électronique

La gestion thermique est le processus de sélection d’un composé thermoconducteur à un ou plusieurs composants sur des circuits imprimés dans les modules de composants électroniques. Le composé thermoconducteur permet d’évacuer la chaleur du circuit imprimé et donc d’augmenter la durée de vie du module de commande. L’interface thermique peut etre aidé avec des caloducs, des plaques froides liquides ou encore des dissipateurs à ailettes.

La proposition de solutions économiques, rapides, pérennes dans le temps est un défi que nous relevons tous les jours.

Une offre pragmatique, compétitive en prix, indépendante de toute marge commerciale, uniquement basée sur le délai de livraison et la technicité du produit

http://www.management-thermique.fr/