k Technology k-Core thermal spreaders effectively extract heat from a surface opposite to an area of concentrated heat load. The resulting thermal spreading effect dissipates heat quickly and significantly reduces both peak temperatures and temperature change (∆T) compared with traditional aluminium designs. The result is increased chip life and potentially higher-power operation.

k Technology k-Core^® thermal spreaders also can offer a low coefficient of thermal expansion, making a high-resistance interface between chip and spreader unnecessary.

Compare the temperature change using a conventional aluminium heat spreader with that of a k-Core thermal solution.